US site
S6YQ | EGX66Y-2U Edge Server
Multi-Access Edge Computing (MEC) 2U Server with Advanced Performance
- 3rd Gen Intel® Xeon Scalable Processor Ice Lake Dual Socket empowered
- Advanced system cooling supporting up to 225W CPU TDP
- 4x 25GbE SFP28 LOM and up to 6x PCIe Gen4 expansion slots for advanced networking
- Support up to two dual-width GPUs for AI workload
- TPM / QAT / PFR optional
- AC / DC Power redundancy and efficiency
- NEBS / ORAN compliant
Flexible and Scalable Configurations
Enhanced Security
- Chassis intrusion triggered when top cover removed while AC/DC on, to alter and log any possible breach to your QCT servers.
Easy Management
- Secure and dynamic data administration of data center resources with Orqestra (QCT System Manager).
- Monitor up to 5000 devices per Orqestra module.
Tailor-Made for 5G Telco and MEC Edge servers
Open RAN transforms the architecture of mobile networks by bringing NFVi cloud, AI inference and optimized management into the radio access networks, enabling unlimited orchestration possibilities with future new applications and eventually assembling the ultimate 5G world.
This product line is built for realizing the Open RAN in different scenarios, including Centralized RAN and Distributed RAN. The server design is tailor-made for vRAN workloads with O-RAN function split option 7-2, advanced time synchronization and virtualization.
The S6YQ | EGX66Y-2U is a 3rd Gen Intel® Xeon® Scalable Processor Dual Socket based short depth MEC server. High Performance, I/O expandability and power efficiency provides best-in-class open platform for 5G Open RAN, private 5G networks, and a broad range of 5G MEC applications. EGX66Y-2U design is driven by ORAN and OTII, and also meets NEBS level 3.
Processor
Processor Family
3rd gen Intel® Xeon® Scalable Family
Processor Type
3rd gen Intel® Xeon® Scalable Processors
Max. TDP Support
225W
Number of Processors
2 Processors
Form Factor
2U
Dimensions
W x H x D (inch)
17.7" x 3.4" x 16.5"
W x H x D (mm)
447.8 x 86.3 x 400 mm
Storage
Default Configuration
(2) NVMe/SATA3 M.2 2280/22110
(4) 2.5” U.2 SSD
(2) 2.5” U.2 SSD (rear optional)
RAID (optional)
Memory
Total Slots
16
Capacity
Up to 2TB of memory for ECC RDIMM/LRDIMM
Memory Type
3200 MHz DDR4 RDIMM/LRDIMM
Expansion Slot
Default Configuration
(4) FH3/4 PCIe Gen4 x16
or (2) DW GPU
(2) FHHL PCIe Gen4 x16
Network Controller
LOM
(4) 25 GbE SFP28
Front I/O
(2) USB 3.0 type-A ports
(1) VGA (via RunBMC)
(4) HDD LED on each HDD tray (ACT & LOC/ERR LED)
(1) ID Button/ LED
(1) Power Button/ LED
(1) PFR Status LED
(1) Fault (Status) LED
(1) RJ45 Management Port
(1) LAN Ports 1GbE RJ45
(4) 25GbE SFP28
(1) 1PPS in SMA connector
(1) COM port for serial port (micro-USB Type-B)
Power Supply
800W/1600W AC/DC single/redundant PSU
Onboard Storage
(2) NVMe/SATA3 M.2 2280/22110
Optional Storage
(2) 2.5” U.2 SSD (rear optional)
Fan
(5) 6056 dual rotor fans (N+1 redundant)
System Management
IPMI v2.0 Compliant, Redfish V1.11 Compliance
QCT Orquestra (Optional)
Operating Environment
Operating temperature: -5°~ 55°C
Non-operating temperature: -40°C to 70°C
Operating relative humidity: 5% to 85%RH
Non-operating relative humidity: 50% to 93%RH
TPM
SPI 2.0
| Title | Version | Date | Size | |
|---|---|---|---|---|
| S6YQ Brochure |  |
| Title | Version | Date | Size | |
|---|---|---|---|---|
| HS Product Catalog | |
S6YQ | EGX66Y-2U
High-performance, Versatile, Flexible and Intelligent Edge Computing
- 3rd Gen Intel® Xeon Scalable Processor Dual Socket empowered
- Front access design for centralized/distributed Radio Access Network (RAN)
- Distinguished, flexible I/O design supports up to six PCIe Gen4 expansion slots (Multiple SKUs options)
- Support up to two dual-width GPUs for AI workload
- 400mm ultra-short depth for footprint minimization
- NEBS Level 3 and ORAN compliant
- Thermal enhancements for -5°~55°C critical environment
-
$AUD $6,247.50
*RRP Pricing*To View Channel Discounts Please Login