GS3 | G593-SD1-AAX3
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP NVIDIA HGX™ H200 8-GPU
# AI # AI Training # AI Inference # HPC
Accelerating Artificial Intelligence and Leading Efficiency
Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey. AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors. Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage. Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads. For this new platform, HYPERSCALERS has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.
Redefine Performance with 4th/5th Gen Intel® Xeon® Scalable Processors and Intel® Xeon® CPU Max Series

GS3 | G593-SD1-AAX3 Product Overview
GS3 | G593-SD1-AAX3 Block Diagram
High Performance
Supports NVIDIA HGX™ H200 8-GPU
The NVIDIA HGX™ H200 combines H200 Tensor Core GPUs with high-speed interconnects to deliver extraordinary performance, scalability, and security for every data center. Configurations of up to eight GPUs deliver unprecedented acceleration, with a staggering 32 petaFLOPS of performance to create the world’s most powerful accelerated scale-up server platform for AI and HPC. An eight-way HGX H200 provides over 32 petaflops of FP8 deep learning compute and 1.1TB of aggregate high-bandwidth memory. NVIDIA HGX™ H200 also includes NVIDIA BlueField®-3 data processing units (DPUs) to enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.
Power Efficiency
Automatic Fan Speed Control
Enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
High Availability
Smart Ride Through (SmaRT) 
To prevent server downtime and data loss as a result of loss of AC power, we implement SmaRT in all server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.
Dual ROM Architecture 
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.
Hardware Security
Optional TPM 2.0 Module 
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
User Friendly
Tool-less Drive Bays Design
Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.
Certified Ready with Software Partners
Being a member of key software alliance partner programs enables us to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.
Dimensions (WxHxD, mm)
5U
447 x 219.7 x 945
Motherboard
MSB3-G41
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
32 x DIMM slots
DDR5 memory supported
8-Channel memory per processor
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)
LAN
Front (I/O board - CDCG120):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]
- (NVMe from PEX89104)
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Support optional RAID add-in cards
Modular GPU
NVIDIA HGX™ H200 with 8 x SXM GPUs
PCIe Expansion Slots
Extension Board CPBG044 x 2:
- 8 x LP x16 (Gen5 x16), from PEX89104
Riser Card CPBGD20 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - CDCG120:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
MLAN board - CDB66:
1 x MLAN port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Red Hat Enterprise Linux 9.2 or later
Windows Server 2022
System Fans
Motherboard:
2 x 40x40x28mm (25,000rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (32,000rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
11 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-SD1-AAX3
2 x CPU heatsinks
6 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NG593SD1DR000ABX3*
- Motherboard: 9MSB3G41NR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU heatsink: 25ST1-24320H-M1R
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562M-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 80x80x80mm: 25ST2-888032-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Riser card - CPBGD20: 9CPBGD20NR-00*
- I/O board - CDCG120: 9CDCG120UR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG903: 9CPBG903NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-23000J-D0S
Title | Version | Date | Size | |
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HS Product Catalog | ![]() |
GS3 | G593-SD1-AAX3
- NVIDIA HGX™ H200 8-GPU
- 900GB/s GPU-to-GPU bandwidth with NVIDIA® NVLink™ and NVSwitch™
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA BlueField®-3 DPUs/SuperNICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
- 4 x FHHL PCIe Gen5 x16 slots
- 8 x LP PCIe Gen5 x16 slots
- 4+2 3000W 80 PLUS Titanium redundant power supplies

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$AUD $63,860.00
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