End-to-End AI Supercomputing Platform
NVIDIA HGX H100/H200 8-GPU server
This 7U dual-socket server is powered by 5th Gen Intel Xeon® Scalable Processors and eight NVIDIA H100/H200 Tensor Core GPUs. Designed to accelerate the development of AI and data science, HGX3 offers a dedicated one-GPU-to-one-NIC topology and supports up to eight NICs for the highest throughput during compute-intensive workloads. To reduce operating costs, the HGX3 | ESC N8-E11/ESC N8-E11V is engineered to provide effective cooling and innovative components that deliver thermal efficiency, scalability, and unprecedented performance.
KEY FEATURES
- Fueled by dual 5th/4th Gen Intel® Xeon® Scalable processors, supporting 350W TDP
- Direct GPU-to-GPU interconnect via NVLink delivers 900GB/s bandwidth for efficient scaling
- A dedicated one-GPU-to-one-NIC topology: Supports up to 8 NICs for the highest throughput during compute-intensive workloads
- Modular design with reduced cable usage: Shorten assembly time and improve thermal optimization
- Advanced NVIDIA technologies: The full power of NVIDIA GPUs, BlueField-3, NVLink, NVSwitch, and networking
- High level of power efficiency: 4+2 80 PLUS Titanium power supplies
- Optimized thermal design: Supports direct-to-chip (D2C) cooling solution and features dedicated CPU and GPU airflow tunnels for efficient heat dissipation
PCIe 5.0 Ready
Faster storage, graphics and networking capabilities
PCI Express® (PCIe®) 5.0 delivers 32 GT/s bandwidth, which is twice the speed of PCIe 4.0, and offers lower power consumption, better lane scalability and backwards compatibility. These servers are PCIe 5.0 ready, with scalable designs to satisfy the increasing workloads or modern data centers.
System Layout
Block Diagram
One-GPU-to-1-NIC Topology
Supports 8 NICs and 8 GPUs in one system
A dedicated 1-GPU-to-1-NIC topology that allows the ESC N8A-E12 to support up to 8 NICs, delivering the highest throughput for compute-intensive workloads.
Modular Design with Reduced Cable Usage
Easy troubleshooting and thermal optimization
The modular design greatly reduces the amount of cables used, resulting in a shortened system assembly time and avoiding cable routing, as well as improving thermal optimization by lowering the risk of choked airflow.
Advanced NVIDIA Technologies
The full power of NVIDIA GPUs, DPUs, NVLink, NVSwitch, and networking
The HGX3 accelerates the development of AI and data science by incorporating fourth generation NVLink and NVSwitch technology, as well as NVIDIA ConnectX-7 SmartNIC. This also empowers GPUDirect® RDMA, storage with NVIDIA Magnum IO™, and NVIDIA AI Enterprise – the software layer of the NVIDIA AI platform.
Sustainability
Keep your data center green
Data centers can consume huge amounts of electricity, raising environmental concerns. These servers are designed to optimize both total cost of ownership (TCO) and total cost to the environment (TCE), including thermal design, power efficiency and advanced cooling solutions — reducing the impact of our products on the planet.
Optimized Thermal Design
A two-level GPU and CPU sled for thermal efficiency
The HGX3 features a streamlined design with dedicated CPU and GPU airflow tunnels for efficient heat dissipation. The two-level GPU and CPU sled design enhances thermal efficiency, scalability, and overall performance by allowing heat to be expelled into the surrounding ambient air – resulting in greater energy efficiency and overall system power savings.
4+2 Power Supplies
High level of power efficiency
To reduce operating costs, the HGX3 provides effective cooling and innovative components. The 80 PLUS Titanium power supplies come in a redundant 4+2 or 3+3 arrangement to efficiently deliver an abundance of power.
Comprehensive liquid-cooling solutions
Better data-center power efficiency
As liquid cooling is maturing in the age of supercomputing, HGX3 is purpose-built for sustainability and ready to support direct-to-chip (D2C) cooling by request for maximum data-center energy efficiency.
Serviceability
Improved IT operations efficiency
Processor / System Bus
2 x Socket
4th Intel® Xeon® Processor Scalable Family (Up to 350W)
5th Intel® Xeon® Processor Scalable Family (Up to 350W)
Memory
Total Slots:
32 (8 channel per CPU, 16 DIMM per CPU)
Capacity:
Maximum up to 4TB per CPU socket
Memory Type:
4th: DDR5 5600 RDIMM/ 3DS RDIMM (2DPC)
5th: DDR5 5600 RDIMM/ 3DS RDIMM (2DPC)
Memory Size:
64GB, 32GB, 16GB RDIMM
256GB, 128GB RDIMM 3DS
* Refer to support page for more information
Expansion Slots
ESC N8-E11 H100 SKU:
12 x PCIe Gen5 slots
[PCIe Switch directly]
- 8 x PCIe Gen5 x16 link (LP, HL)
[CPU directly]
- 1 x PCIe Gen5 x16 link (FH, HL)* + 1 x PCIe Gen5 x16 link (FH, HL)*
- 1 x PCIe Gen5 x8 link (FH, HL) + 1 x PCIe Gen5 x8 link (FH, HL)
*Support PCIe x16 link for DPU
ESC N8-E11V H200 SKU:
10+1 x PCIe Gen5 slots
[PCIe Switch directly]
- 8 x PCIe Gen5 x16 link (LP, HL)
[CPU directly]
- 1 x PCIe Gen5 x16 link (FH, HL)* + 1 x PCIe Gen5 x16 link (FH, HL)*
- 1 x PCIe Gen4 x8 link from CPU2 DMI (FH, HL)**
*Support PCIe x16 link for DPU
**For Raid card to connect storage
[BF3 operation temperture 30℃ when using transceiver]
Storage
Optional Kits:
-Broadcom MegaRAID 9560-16i
-Broadcom MegaRAID 9540-8i
Drive Bays
10 x 2.5” hot-swap drive bays (8 NVMe, 2 NVMe/SATA/SAS*)
[PCIe Switch directly]
Front: 8 NVMe
[CPU directly]
Rear: 2 NVMe(CPU2)/SATA(PCH)
H100 SKU
2 x M.2 Gen5 x4 link (CPU1) / 2 x M.2 Gen3 x2 link (PCH)
H200 SKU
2 x M.2 Gen3 x2 link (PCH)
Networking
2 x 10 Gigabit LAN ports (Intel X710-AT2 Controller)
1 x Management Por
Front I/O Ports
4 x USB3.2 Gen1 ports
1 x VGA port
2 x 10Gb RJ45 LAN module (Intel-x710 Based)
1 x Mgmt LAN
1 x locate button
1 x power button
Rear I/O Ports
1 x locate button
1 x power button
Switch/LED
Front :
1 x Power Button/LED
1 x Location Button/LED
1 x Message LED
1 x Q-Code/Port 80 LED
Rear :
1 x Location LED
1 x Power Button/LED
Regulatory Compliance
BSMI, CB, CE, FCC, KCC
Dimensions
885mm x 447mm x 306.65mm
Form Factor
7U
Weight
Net Weight: 113 Kg.
Gross Weight: 174 Kg.
Power Supply
4+2 Redundant 3000W 80 PLUS Titanium Power Supply
Environment
Operation temperature: 10℃ ~ 35℃
Non operation temperature: -40℃ ~ 70℃
Non operation humidity: 20% ~ 90% ( Non condensing)
Title | Version | Date | Size | |
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Product Catalog | ![]() |
HGX3 | ESC N8-E11
NVIDIA HGX™ H100/H200 8-GPU server
- 7U NVIDIA HGX™ H100/H200 eight-GPU server
- Dual 5th/4th Gen Intel Xeon Scalable processors
- Designed for large-scale AI and HPC
- Up to 12 PCIE slots
- 32 DIMM
- 10 NVMe
- Dual 10Gb LAN
- OCP 3.0 (optional)
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$AUD $72,850.00
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